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                              All Seals Incorporated 
                                  The Sealing Specialists  
          2110 S. Yale Street 
          Santa Ana, CA 92704  
          Phone: (714) 556-4931 
          Fax: (714) 557-3257 
         
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                      10-3050 
                        NON-SAG, BUTTER-ON EPOXY COATING | 
                     
                    
                      10-3050 is a thixotropic, Non-Sag, gel epoxy 
                        designed to protect motor windings from abrasives, chemicals, 
                        vibration, oils, jet fuels, etc... 10-3050 self levels to 
                        a smooth void free coating once applied with a spatula or 
                        brush. 
                        10-3050 stays exactly where applied and will not run out 
                          of coil windings or stator slots. This unique adhesive forms 
                          a tenacious bond to most substrates. 
                        10-3050 is color coded to facilitate proper mixing of Resin 
                          and Catalyst. 10-3050 Resin is White and Catalyst is Black. 
                        
                          
                            | Typical Specifications | 
                           
                          
                            | Mixed viscosity, 25°C, cps | 
                            Paste | 
                           
                          
                            | Pot life, 25°C | 
                            40 Minutes | 
                           
                          
                            | Color mixed | 
                            Grey | 
                           
                          
                            | Specific gravity, 25°C/25°C | 
                            1.4 | 
                           
                          
                            | Hardness, shore D | 
                            75D | 
                           
                          
                            | Shrinkage linear, in/in | 
                             .002 | 
                           
                          
                            | Tensile strength, psi | 
                            8,000 | 
                           
                          
                            | Compressive strength, psi | 
                            20,500 | 
                           
                          
                            | Water absorption, 240 hrs, 96% rh, % weight grain | 
                            0.8 | 
                           
                          
                            | Operating temperature range, °C | 
                            -60 to +160 | 
                           
                          
                            | Thermal conductivity, Btu in/ft2 hr °F | 
                            4.1 | 
                           
                          
                            | Thermal expansion coefficient, per °C | 
                            49 x 10-6 | 
                           
                          
                            | Dielectric strength, volts/mil | 
                            485 | 
                           
                          
                            | Dielectric constant, 60 Hz | 
                            0.01 | 
                           
                          
                            | Dissipation factor, 60 Hz | 
                            .015 | 
                           
                          
                            | Volume resistivity, ohm-cm | 
                            4.0 x 1014 | 
                           
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                      MP 5405 | 
                     
                    
                      MP 5405 is a two part unfilled 
                        epoxy adhesive designed for ceramics, and most plastics. It 
                        cures to a tough semi-rigid material, and is free flowing 
                        in viscosity. It gives good resistance to water, salt spray, 
                        inorganic acids and bases, and most organic solvents. It was 
                        especially formulated to a 1:1 mix ratio for use in either 
                        MMD equipment or side-by-side dual cartridges for easy dispensing. 
                        A handling cure is normally achieved at room temperature 
                          within 20 - 30 minutes with full cure in 24 hours. An elevated 
                          temperature cure schedule can be used to reach final properties 
                          quickly. 
                        Handling and Storage: 
                        
                          - 1) Bring both components to room temperature prior to 
                            mixing. Mix 1 parts A to 1 part B thoroughly.
 
                          - Allow to cure undisturbed until product is fully gelled 
                            or tack-free to the touch.
 
                          - Clean up uncured resin with suitable organic solventsuch 
                            as MEK, acetone or a chlorinated.solvent.
 
                           
                        Mix Ratio: 1A:1B by weight or 1A:1B by volume. 
                        Shelf Life: 12 Months  | 
                     
                     
                   
                  
                    
                      MP 54750
                         
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                      MP 54750 is a two part unfilled 
                        epoxy structural adhesive designed for bonding application 
                        requiring conformance to the Code of Federal Regulations Title 
                        21 175.105 (Adhesives) and 175.300 (Resinous and polymeric 
                        coatings)1. It cures completely at room temperature to a tough, 
                        semi-rigid polymer. It has good wetting and adhesion to most 
                        surfaces and has a free flowing viscosity. It has very good 
                        resistance to water, acids and bases and most organic solvents. 
                        It was especially formulated to a 1A:1B volume mix ratio 
                          for use in side-by-side dispensing cartridges and meter/mix 
                          and dispense equipment. MP 54750 will reach full cure at room 
                          temperature within 24 –48 hours. Cure time can be accelerated 
                          by the application of heat. Times and temperatures from 2 
                          hours at 150F to 10 minutes at 225F are typical for most applications. 
                          Time to heat substrate must be taken into account. Cooler 
                          temperatures will also extend work time and increase cure 
                          times.  | 
                     
                     
                   
                  
                    
                      MP 54190 | 
                     
                    
                      MP 54190 is a two part mineral 
                        filled epoxy adhesive designed for bonding metals and plastics. 
                        It cures at room temperature to a tough, semi-flexible material. 
                        It has good wetting to most surfaces and is free flowing to 
                        penetrate cavities and give good self leveling and air release. 
                        This product gives very good vibration and impact resistance. 
                        It gives good resistance to water, salt spray, inorganic acids 
                        and bases and most organic solvents. 
                        It was especially formulated to a 1A:1B volume mix ratio 
                          for use in side-by-side dispensing cartridges and meter/mix 
                          and dispense equipment. MP 54190 will reach handle cure at 
                          room temperature within 16 – 24 hours. Cure time can 
                          be accelerated by the application of heat. Times and temperatures 
                          from 2 hours at 65°C to 20 minutes at 100°C are typical 
                          for most applications. Time to heat substrate must be taken 
                          into account. Cooler temperatures will also extend work time 
                          and increase cure times.  | 
                     
                     
                   
                  
                    
                      Scotch-Weld™ 
                        Epoxy Adhesive 
                        2216 B/A Gray • 2216 B/A Tan NS • 2216 B/A Translucent | 
                     
                    
                      3M™ Scotch-Weld™ 
                        Epoxy Adhesive 2216 B/A Gray, Tan NS and Translucent are flexible, 
                        two-part, room temperature curing epoxies with high peel and 
                        shear strengths. 
                        Advantages 
                        
                          - Excellent for bonding many metals, woods, plastics, rubbers, 
                            and masonry products.
 
                          -  Base and Accelerator are contrasting colors.
 
                          -  Good retention of strength after environmental aging.
 
                          -  Resistant to extreme shock, vibration, and flexing.
 
                          -  Excellent for cryogenic bonding applications.
 
                          -  2216 B/A Gray Adhesive meets MIL-A-82720 and DOD-A-82720.
 
                          -  2216 B/A Tan NS Adhesive is non-sag for greater bondline 
                            control.
 
                          -  2216 B/A Translucent can be injected.
 
                           
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